IceMos Technology offers a wide range of additional processing services for customers who simply require a high quality single unit process to be performed on their own wafers.
Icemos offers high resolution SAM (Scanning Acoustic Microscope) imaging of our bonded BSOI and CSOI wafers, this can also be offered as a service for customer’s own bonded wafers. SAM inspection offers a means of non-destructive imaging of the bonded interface. In contrast to common non-destructive test methods such as conventional ultrasonic test methods, infrared microscopy and x-ray microscopy, Scanning Acoustic Microscopes scan the specimen surface pixel to pixel, line to line and detect with a special transducer the reflected ultrasonic waves out of the specimen. Icemos SAM inspection offers a detection limit in the range of 10µm lateral size of delamination with a delaminated height in the range of 15nm. Icemos can offer high resolution whole wafer scanning on wafer diameters 100mm – 200mm with a pixel size as small as 20 µm. Individual areas of the wafer can be scanned at higher resolutions.
IceMOS Technology will use engineering expertise to develop a process flow and CAD (Computer Aided Design) layout used to develop a new set of masks or cross-sectional concept drawings.
The standards of IceMOS unit process foundry services are unsurpassed by any other foundry. With processes operated within an ISO/TS 16949 manufacturing environment, controlled to tight tolerances by Statistical Process Control (SPC) and within contamination standards required by advanced CMOS, IceMOS offers you the perfect solution. All this is supported by a fast turnaround service and high compliance on On-Time-Delivery.