IceMos Technology

AN INTRODUCTION TO OUR ENGINEERED SILICON SUBSTRATES

IceMOS Technology is a best-in-class supplier of cost effective/high performance Super Junction MOSFETs, MEMS solutions and Advanced Engineering Substrates.

Encompassing over 20 years of expertise, unsurpassed manufacturing skill and the latest developments in technology, IceMOS ensures that each customer receives outstanding service from the point of initial enquiry through to product delivery. Along with offering innovative product development, design and specialized services, the engineering team at IceMOS provides an array of technical support.

IceMOS will work directly with the customer to develop a unique specialised product if this is not already on offer. It is with this, that IceMOS�s product portfolio remains unrivaled.

Keywords:
SOI = Silicon on Insulator
SiSi = Silicon Silcion (bonded wafer)
MEMS = Microelectromechanical Systems
IC = Integrated Circuit

Contact our Sales Department if you would like to discuss a different product.

SOI Wafer

IceMOS have extensive experience in a variety of SOI substrates and our highly skilled applications engineering team is available to assist you to select the optimum combination of parameters for your requirements, ensuring that you receive the perfect custom SOI solution for your application.

SiSi Wafer

For semiconductor device manufacturers, the IceMOS SiSi bonded wafer offers a cost effective alternative to thick epitaxial layers and inverse epi that have traditionally been used for applications such as power devices and PiN diodes.

DSP Wafer

IceMOS DSP wafers are an excellent substrate for double sided lithography processing; IceMOS expertise and knowledge of the product and the processes allow for exceptional thickness control.

DSOI Wafer

IceMOS Technology is a leading supplier of DSOI for a large range of IC and MEMS applications. We have extensive experience in SOI substrates and our applications engineering expertise can help you select the best combination of parameters to aid your processing on the DSOI wafers.

CSOI Wafer

The IceMOS Cavity Bonded SOI contains pre-etched features embedded under a silicon membrane. This provides an opportunity for the customer designers to develop more intelligent devices in order to meet the most demanding markets.

TSOI Wafer

Delivering high voltage isolation between components on the same chip. Isolation is achieved using thick film SOI technology combined with state of the art high aspect ratio deep trench etching and oxide/poly refill

TSV Wafer

The IceMOS Technology solution is a pre-processed substrate which is delivered to the customer with the interconnect already formed within the substrate. This substrate is fully CMOS compatible.

Foundry Services

IceMos Technology offers a wide range of additional processing services for customers who simply require a high quality single unit process to be performed on their own wafers. Services include high resolution SAM (Scanning Acoustic Microscope) images of bonded wafers, CAD (Computer Aided Design) layout to improve your process flow and DRIE Etch.

�

Products